Includes the GeneticEM optimizer, allowing for robust electromagnetic optimization of complex shapes and goals.
: Native 64-bit multi-threading allows the software to seamlessly scale simulations across modern multi-core workstations.
Engineers often import complex geometries from Cadence Allegro, Altium, or SolidWorks. V15.127 includes a . It automatically detects and fixes: zeland ie3d v15 127 new
V15.127 introduces a . Previously, IE3D excelled in homogeneous or layered dielectrics. Now, v15.127 allows for arbitrary, inhomogeneous dielectric volumes (e.g., a package mold compound with air voids) to be discretized with FEM, while planar traces remain in MoM. The new build optimizes the iterative solver for this hybrid matrix, reducing memory consumption by up to 25% for complex systems like ball grid array (BGA) packages.
| Feature | Zeland IE3D v15 (2010) | | CST Studio Suite | | :--- | :--- | :--- | :--- | | Core Technology | Method of Moments (MoM) | Finite Element Method (FEM) | Finite Integration Technique (FIT) | | Primary Strength | Excellent for planar, layered structures (PCBs, packages, antennas) | Highly accurate for arbitrary 3D structures (connectors, waveguides) | Broadband time-domain solver for wideband applications | | Best Suited For | Microstrip antennas, RFICs, PCB signal integrity | Complex, non-planar geometries where accuracy is paramount | Large, complex systems like antennas on vehicles or EMI/EMC analysis | | User Interface | Dedicated interface, highly optimized for its 3D planar design flow | Integrates with Ansys DesignXplorer for parametric analysis | Advanced system and circuit co-simulation capabilities | | Performance | Very efficient for multi-layer planar structures | Computationally intensive for large designs | Very efficient for transient problems and large structures | Now, v15
For engineers currently using older versions of IE3D or other simulation tools, v15 127 offers compelling advantages:
The "new" engine in this version offers drastic improvements in speed and efficiency, particularly in solving Green's functions. a 20-layer PCB with 500+ ports)
: The solver generates 3D visual representations of current distributions across metal boundaries. This helps identify current crowding, unexpected hot spots, and structural discontinuities.
While IE3D has supported GPU acceleration since v14, v15.127 introduces . It now leverages NVIDIA’s CUDA 11.x architecture and AMD’s ROCm stack. For a large problem (e.g., a 20-layer PCB with 500+ ports), the solver can distribute the matrix filling and iterative solution across four GPUs, achieving a 4.7x speedup over CPU-only simulation.